Electronic fluorinated solvent fluorinated solvent electronic detection solution
In general, the heat dissipation effect of immersion liquid cooling is still very good, and it is much better than air cooling and water cooling. First of all, immersion liquid cooling can be seen from the name. It is a heat dissipation method that immerses all electronic components in liquid and quickly takes away heat through the flow of liquid. In this heat dissipation method, since all the electronic components are immersed in the cooling medium, the heat dissipation is all-around heat dissipation, and the heat dissipation efficiency is higher.
Single-phase immersion liquid cooling
The electronic components are directly immersed in the dielectric liquid, which is placed in a sealed but easily accessible container, and heat is transferred from the electronic components to the liquid. The heated electron fluorinated solvent is typically flowed to a heat exchanger using a circulation pump, where it is cooled and recycled back to the vessel.
Two-phase immersion liquid cooling
In the two-phase immersion liquid cooling, the heat transfer efficiency of the liquid is exponentially improved through the boiling and condensation process of the electron fluorinated solvent. The electronic components are directly immersed in the dielectric liquid in a container that is airtight but easy to handle. Within this vessel, heat is transferred from the electronic components into the liquid, causing the liquid to boil and produce steam. The steam condenses on a heat exchanger (condenser) inside the container, transferring heat to the facility cooling water circulating in the data center.
until the chip cools
Until the chip cools, the heat is dissipated by pumping the circulating liquid medium through the cold plate assembled to the electronic components. Liquids do not come into direct contact with electronic equipment. While non-dielectric liquids (eg, water/ethylene glycol) are typically used for direct-to-chip cooling, dielectric electron fluorinated solvents can also be used in direct-to-chip applications, mitigating leak-related risks and improving hardware/IT equipment reliability. Direct-to-die cooling can be achieved using single-phase and two-phase technologies.
Immersion liquid cooling is a method used to cool data center IT hardware by directly immersing the hardware in a non-conductive liquid. The heat generated by the electronic components is efficiently transferred directly to the immersion liquid. This reduces the need for thermal interface materials, heat sinks, fans, shrouds, sheet metal, and other components commonly found in traditional cooling methods. Normally, fluorine-containing liquids with lower boiling points are mainly used for two-phase immersion liquid cooling.